![]() The average recommended heating times for eutectic and lead-free solders are typically close enough to make any differences negligible for these calculations. Solder paste manufacturers generally provide a fairly wide window (in terms of total heating time) for the various stages of the reflow profile - 120 to 240 seconds for preheat and soak, 60 to 120 seconds for reflow/time above liquidous. The first thing to consider are your solder paste manufacturers’ recommended profiles for the paste formulas you will be using. In fact, smaller, simpler, and more affordable 4- to 6-zone models are some of our best sellers, and do an outstanding job in handling pick and place throughput, meeting solder paste manufacturers’ reflow specs, and providing reliable, high-quality soldering performance.īut how can you be sure? How much volume can a 4-, 5-, or 6-zone oven handle? A few simple calculations based on data from your solder paste and equipment suppliers will give you a pretty good idea: Solder Paste Heating Time While long, 8- to 10-zone ovens and faster belt speeds may be the best solution in a high-volume manufacturing environment, our experience shows that, for the vast majority of medium- and lower-volume, high-mix assembly lines common in the U.S (and many other countries), shorter reflow ovens can easily keep pace. As a result, many manufacturers find themselves spending more money-and sacrificing more floor space-than they really need to. ![]() ![]() Many electronic assemblers assume they need a longer reflow oven to meet their throughput requirements and to provide more precise control of their solder profiles, especially if they’re working with lead-free solders. Automated Optical Inspection Expand submenu.Dry Boxes for SMD Storage Expand submenu.THT Soldering Accessories Expand submenu.Conveyors & PCB Handling Expand submenu.SMT Pick & Place Machines Expand submenu.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |